Flex PCB and Rigid Flex PCB Manufacturer, Flexible Printed Circuit Boards
Flexible PCB is mainly divided into single-sided flex PCB, hollow FPCB board, double-sided Flex PCB, multi-layer flexible board, and rigid-flexible PCB board.
FASTPCBA provide 1- 12 Layer Flexible PCB Manufacturing services for both quick turn prototypes and production quantities. Flexible circuit fabrication and assembly, Our Engineer provide free DFM Checking.
Technical parameter
| Number of layers | 1 - 2 |
| Copper | One-sided or double-sided |
| Surface | Electroless Nickel Immersion Gold |
| Foil material | Polyimide |
| Polyimide thickness | 50 μm |
| Copper thickness | 18 µm |
| PCB thickness | 0.2 mm |
| Maximum size of the PCB | Length: 400 mm / Width: 250 mm |
| Minimum size of the PCB | Length: 10 mm / Width: 10 mm |
| Flex cover foil | Relief cut: 200 μm |
| Minimum conductor width / conductor distance | 125 μm |
| Vias | Via diameter: 200 μm |
| Minimum distance Via-Via | 450 μm |
| Minimal cutting radius | 100 μm |
| Minimum distance copper contour | 200 μm |
| Milling tolerance | +/- 100 μm |
| Silkscreen | both sides |
Main Raw Materials of FPC
The main raw materials include: 1. base materials, 2. cover film, 3. reinforcement, 4. other auxiliary materials.
1) Substrate
1.1 Adhesive substrate
Adhesive substrates are mainly composed of three parts: copper foil, adhesive, and PI. There are two types of single-sided substrates and double-sided substrates. The material with only one side of copper foil is a single-sided substrate, and the material with double-sided copper foil is a double-sided substrate.
1.2 Adhesive-free substrate
The non-adhesive substrate is the substrate without the adhesive layer. Compared with the ordinary adhesive substrate, the middle adhesive layer is missing and composed of copper foil and PI. Thus, the non-adhesive substrate is thinner than the adhesive substrate. It also has other advantages, such as better dimensional stability, higher heat resistance, higher bending resistance, and better chemical resistance. Currently, it has been widely used.
Copper foil: At present, the commonly used copper foil thickness has the following specifications, 1 oz, 1/2 oz, 1/3 oz. A thinner copper foil with a thickness of 1/4 oz is also on the market. However, this kind of material is currently used in China and makes ultra-circuit (line width and line spacing are 0.05 mm and below) products. With the increasing requirements of customers, materials of this specification will be widely used in the future.
2) Cover film
It is mainly composed of three parts: release paper, glue, and PI. In the end, only the glue and PI remain on the product. The release paper will be torn off during the production process and will not be used again (its role is to protect the glue from foreign matters).
3) Flexible PCB Stiffener
The stiffener is a specific material used for FPC. It is used in a specific part of the product to increase the support strength to enhance the “soft” characteristic of FPC.
At present, The commonly used reinforcement materials are as follow:
1) FR4 stiffener: The main components are glass fiber cloth and epoxy resin glue, which are the same as the FR4 material used in PCB.
2) Steel sheet stiffener: The composition is steel, which has strong hardness and support strength.
3) PI stiffener: The same as the cover film, consisting of PI and release paper. However, the PI layer is thicker, and it can be produced from 2 MIL to 9 MIL.
4) Other auxiliary materials
1) Pure glue: This adhesive film is a heat-curing acrylic adhesive film composed of protective paper/release film and a glue layer. It is mainly used for layered boards, rigid and flexible boards, and FR-4/Steel sheet reinforcement board, which plays a role in bonding.
2) Electromagnetic protective film: Paste on the board surface for shielding.
3) Pure copper foil: Only composed of copper foil, mainly used for hollow board production.
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